To worry about that kind of pin QFP deformation. The package is developed by Motorola, the first portable phones and other devices used in the future in the United States is possible in the popularity of personal computers. Initially, BGA pin (bump) for the center distance of 1.5mm, pin number is 225. LSI now some manufacturers are developing 500-pin BGA. BGA problem is the appearance after reflow inspection. It is not clear whether the appearance of an effective method of examination. Some believe that as a result of welding the center distance of a larger connection can be seen as a stable, only through the function test to deal with it. Motorola United States companies to use molded resin sealed package called OMPAC, and the casting method known as the sealed package GPAC (see OMPAC and GPAC).

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